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Adhesive joints & interfaces

Veryst engineers have broad expertise in the chemistry and mechanics of adhesive joints and bonded interfaces. We use this expertise to help clients design robust adhesively bonded structures and to understand delamination failures. Veryst offers a full suite of engineering services including materials selection, chemical analysis, mechanical testing, structural analysis, and multiphysics modeling.

Materials Selection: Veryst engineers assist clients with the selection of primers and adhesives for use in a wide range of technologies. We leverage expertise in both adhesive assembly and adhesive formulation chemistry to help clients select and modify materials for difficult bonding applications.

Molecular Structures

Molecules Used in Adhesive and Primer Formulations

Chemical Analysis:
Veryst recommends appropriate characterization tools and provides clear interpretation, whether characterizing surfaces to be bonded or surfaces involved in a delamination failure. Our chemical analysis expertise includes:

  • XPS (X-Ray Photoelectron Spectroscopy)
  • ATR-FTIR (Attenuated Total Reflectance – Fourier Transform Infrared Spectroscopy)
  • EDS (Energy Dispersive X-Ray Spectroscopy)
  • AES (Auger Electron Spectroscopy)


Mechanical Testing: Veryst offers mechanical testing services to characterize the strength and toughness of adhesive joints, composite laminates, and material interfaces.  As adhesive strength and toughness can depend upon many factors (interface geometry, loading type, environmental conditions, etc.), we work with clients to design and implement customized testing procedures that expose adhesive joints and interfaces to in-service conditions.

Adhesive Testing

Structural Analysis:  Veryst Engineering conducts stress and fracture mechanics analyses of bonded interfaces to help clients design robust structures and understand failures.  Veryst is a world-leader in finite element modeling of polymeric materials, including adhesives.

Microfluidic Valve Model

 Finite Element Model of Delamination in a Microfluidic Valve

Multiphysics Modeling:
  Advanced adhesive joining processes are inherently multiphysics in nature, involving curing of the adhesive, heat transfer through complex structures, and flow behavior that depends upon the temperature, flow rate, and degree of cure of the adhesive.  Veryst has extensive experience with multiphysics modeling involving fluid flow, fluid-structure interactions, heat transfer, and chemical reactions.   

Flip-Chip Package

Multiphysics Model of Underfill Adhesive Flow and Cure

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