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MEMS expert at Electronics Packaging Symposium

Date: 05-Sep-2019
Location: Niskayuna, New York

Allyson Hartzell co-chaired a Bioelectronics session and gave a talk on "The Importance of MEMS Cavity Gas Composition" at the 31st Annual Electronics Packaging Symposium – Small Systems Integration, which took place September 5-6, 2019 in Niskayuna, New York. This event was presented by GE Research and IEEC-Binghamton University.

Learn more about the symposium.

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