Allyson Hartzell has just published a practical guide to “Avoid these common MEMS failure mechanisms” in an article on the EDN Network’s website. The article provides specific and concrete advice for identifying and avoiding failure mechanisms such as stiction, electrostatic discharge, micro-contamination and mechanical shock during the MEMS design and process development phase to assure a stronger and more reliable product launch. There are also helpful tips for system developers who incorporate MEMS into their products. Read the full article.
Article published on MEMS failure mechanisms
January 21, 2016