News & Events

Webinar on using simulation to design adhesively bonded structures

February 27, 2020
One of the primary challenges in designing adhesively bonded structures is predicting when an adhesive or bonded interface will fail. Dr. Mark Oliver will share two case studies using COMSOL Multiphysics to predict the strength and improve the performance of adhesively bonded structures.

Veryst engineer invited to participate in global electronics forum

February 20, 2020
MEMS and sensors expert Allyson Hartzell is a member of a select committee assembled to develop the Heterogeneous Integration Roadmap which serves as “a guideline for the global electronics industry of projected technology needs and opportunities for innovation.”

Veryst engineer invited to be a judge at Innovation Showcase 2019

December 1, 2019
Allyson Hartzell was invited to be a judge at the iMatSci Innovation Showcase, part of the 2019 MRS Fall Meeting and Exhibit. MRS describes the event as “a platform for technology leaders at universities, research laboratories and startup companies to demonstrate the practical applications of innovative, materials-based technologies.”

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