MEMS expert speaking at Electronics Packaging Symposium

September 5, 2019

Location

Niskayuna, New York

Allyson Hartzell co-chaired a Bioelectronics session and gave a talk on "The Importance of MEMS Cavity Gas Composition" at the 31st Annual Electronics Packaging Symposium – Small Systems Integration, which took place September 5-6, 2019 in Niskayuna, New York.  This event was presented by GE Research and IEEC-Binghamton University.  Learn more about the symposium.

How can we help?