NASA (National Aeronautics & Space Administration) Tech Briefs, a design engineering publication focused on reporting significant new technologies, has published an article by Veryst engineers Allyson Hartzell and Andrew Spann titled “Solving the Interconnect Challenge: How to Bring Flexibility to Wearable Design.” As wearable technologies or “wearables” grow in popularity, MEMS and sensors are becoming increasingly prevalent. Unfortunately, today's rigid circuits can hinder the ease and comfort of the user’s movement and, in response, new manufacturing techniques are emerging for bendable electronics. The article reviews the MEMS devices in today's wearables and demonstrates how a flexible interconnect capability can better support the increasingly popular MEMS-powered technologies. Read the article here.
March 1, 2019