Presentation at adhesives and microelectronics packaging conferences

October 19, 2015
Pittsburgh, Pennsylvania; Orlando, Florida

Dr. Mark Oliver presented at two conferences.  At the Adhesives and Sealants Council Fall Convention & Expo, which took place in Pittsburgh, PA on October 19-21, 2015, Dr. Oliver presented "Testing and Modeling the Mechanical Behavior of Flexible Adhesives."  Learn more about the conference.

Dr. Oliver also presented at the International Microelectronics Assembly and Packaging Society (IMAPS) Meeting, which took place in Orlando, FL on October 26-29, 2015.  Dr. Oliver's presentation was titled "Multiphysics Modeling of Underfill Flow and Cure During Thermocompression Bonding."  Learn more about this conference.

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