Presentation on using DIC test data for material modeling at NAFEMS World Congress

October 25, 2021

Dr. Sean Teller will be presenting "Utilizing Test Data from DIC for Polymer Material Modeling" at NAFEMS World Congress 2021.  This completely online event will take place over five days, beginning October 25, 2021.

Digital Image Correlation (DIC) is a powerful non-contact strain measurement tool for large strain, full-field strain measurement that is easily coupled with material testing.  Full-field strain measurements give simulation engineers a plethora of data that can be used to characterize a material accurately.

In this presentation, Dr. Teller will describe how Veryst performed a digital image correlation and material modeling study on an impact-modified polycarbonate material to investigate what information an engineer can extract with DIC and how best to use full field strain data.  Veryst analyzed the DIC data to extract strain data from different regions of tensile samples and used the strain data to select and calibrate a material model with a single element method, exploring how to use the data from different sample regions to calibrate a more accurate model. 

Dr. Teller's presentation will take place in Session M19, Image-Based Modelling, on October 28 at 10:45am (EDT).  Learn more about NAFEMS World Congress 2021.

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