Ms. Allyson Hartzell will participate in two important events at this year's virtual ECTC conference. ECTC 2020—the 70th Electronic Components and Technology Conference from IEEE (the Institute of Electrical and Electronics Engineers)—was originally scheduled to take place May 26-29, 2020 in Lake Buena Vista, Florida, but has transitioned this year to a free, on-demand virtual event of prerecorded presentations.
Ms. Hartzell will co-chair a technical session on MEMS and sensors, focused on packaging technologies. She has also been invited to be one of three panelists discussing how "Diversity and Inclusion in the Workplace Drives Innovation and Productivity." The panelists will address the way in which our understanding of workplace diversity has expanded beyond race, gender, and ethnicity to include religious, political, educational, and cultural differences, and much more--and the benefits that these varies experiences and perspectives have for the workplace.
This virtual conference will be available online June 3-30, 2020. Learn more about ECTC 2020.