An article on “Trends in MEMS Testing” features the insight and expertise of Veryst’s Allyson Hartzell. The article discusses how the increasing use of MEMS devices is resulting in greater attention being focused on concerns such as the packaging and testing strategies of those devices. Discussion includes the role of OSAT (outsourced assembly and test) providers, the need for more efficient testing and packaging procedures, the move towards common test protocols, and MEMS wafer level testing. The article appears in Business World CIO. Click to read the article.
April 9, 2019