August 27, 2018
San Francisco, California
Allyson Hartzell was invited to participate in a variety of roles at ASME InterPACK 2018—the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, held on August 27-30, 2018 in San Francisco, CA. Ms. Hartzell co-chaired the Mechanical Reliability session as part of the Structural and Physical Health Monitoring track; provided a one-hour tutorial on “Reliability Considerations for Flexible Hybrid Electronics;” and served on the Women in Engineering Panel. Read about the conference.