Allyson Hartzell offered a webinar titled MEMS and Sensors – Reliability for Devices, Packaging and Interconnects in Wearable Technology, which took place on Wednesday, January 24, 2018. The focus of this webinar was on the reliability of MEMS and sensors in wearable systems (here, a system includes the device, its packaging, and the interconnect). The entire system’s hierarchy must be well designed, processed, and without defects. This webinar covered some of the newer MEMS and sensor devices with advanced packaging and flexible interconnects for wearable technologies, and addressed how to assess and model reliability. The webinar was sponsored by the industry association MSIG/SEMI. Learn more about the webinar here.
Webinar on the reliability of MEMS and Sensors in wearable systems
January 24, 2018