July 14, 2016
Veryst is pleased to announce that Allyson Hartzell, an expert in MEMS, was approved as a member of the ECTC Advanced Packaging Committee. ECTC (the Electronic Components and Technology Conference) is an international conference that took place in Lake Buena Vista, Florida on May 30-June 2, 2017. Ms. Hartzell led the MEMS and Sensors subcommittee for the 2017 conference.