May 29, 2018
Location
San Diego, California
Allyson Hartzell co-chaired the “MEMS, Sensor, IoT and Flex” session of ECTC 2018, the annual conference of the IEEE Electronic Components and Technology Conference, which took place May 29-June 1, 2018 in San Diego, CA. This Advanced Packaging session included seven different papers on the session topics. Learn more here.