Session co-chair at ECTC 2018

May 29, 2018
San Diego, California

Allyson Hartzell co-chaired the “MEMS, Sensor, IoT and Flex” session of ECTC 2018, the annual conference of the IEEE Electronic Components and Technology Conference, which took place May 29-June 1, 2018 in San Diego, CA.  This Advanced Packaging session included seven different papers on the session topics.  Learn more here.

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