Webinar on using simulation to design adhesively bonded structures

February 27, 2020
Modeling delamination of silicon die from a stretched flexible substrate
Modeling delamination of silicon die from a stretched flexible substrate

Dr. Mark Oliver offered a webinar on "Using Simulation to Design Robust Adhesively Bonded Structures."  Engineers are increasingly relying upon adhesive bonding to improve the mechanical performance of their structures and devices.  One of the primary challenges in designing adhesively bonded structures is predicting when an adhesive or bonded interface will fail.

Dr. Oliver shared two case studies using COMSOL Multiphysics to predict the strength and improve the performance of adhesively bonded structures: a structural adhesive joint and a stretchable electronics device.  Through these examples, he provided a brief introduction to the method of cohesive zone modeling and the experimental methods used to calibrate these models.

This webinar was of interest to anyone concerned with the mechanical design of structures containing adhesives or bonded interfaces.  The webinar was sponsored by Tech Briefs Media and took place on Thursday, February 27, 2020.  Learn more here.

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