Webinar on using simulation to design adhesively bonded structures

February 27, 2020
Modeling delamination of silicon die from a stretched flexible substrate
Modeling delamination of silicon die from a stretched flexible substrate

Dr. Mark Oliver will be offering a webinar on "Using Simulation to Design Robust Adhesively Bonded Structures."  Engineers are increasingly relying upon adhesive bonding to improve the mechanical performance of their structures and devices.  One of the primary challenges in designing adhesively bonded structures is predicting when an adhesive or bonded interface will fail.

Dr. Oliver will share two case studies using COMSOL Multiphysics to predict the strength and improve the performance of adhesively bonded structures: a structural adhesive joint and a stretchable electronics device.  Through these examples, he will provide a brief introduction to the method of cohesive zone modeling and the experimental methods used to calibrate these models.

This webinar will be of interest to anyone concerned with the mechanical design of structures containing adhesives or bonded interfaces.  The webinar is sponsored by Tech Briefs Media and will take place on Thursday, February 27, 2020.  Learn more or register for the webinar.

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