Manufacturing

Case study

Underfill Adhesive Flow and Cure
The microelectronics packaging industry relies heavily on adhesive bonding to assemble electronic components. Veryst built a COMSOL Multiphysics model of a thermocompression bonding process to help reduce bonding cycle time by simultaneously optimizing material and process variables.

Service

Additive Manufacturing
Veryst Engineering helps clients realize high-performance additively manufactured parts. Our strong foundational knowledge in materials science and mechanics coupled with practical expertise in experimental methods and engineering software make us uniquely qualified to solve complex additive manufacturing challenges.
Clean Manufacturing
Veryst consults in clean manufacturing, which is common for precision products that are deleteriously affected by particulate, molecular contamination, and human contamination. Key areas are: target contamination control levels for the room and equipment, detection and measurement of contamination, transport and deposition of contamination, removal of contamination, and sources of contamination.
Failure Analysis

The consultants at Veryst provide failure and root cause analyses using core engineering disciplines to evaluate different failure scenarios.  Engineering specialties we apply to failure analyses include: mechanical engineering, materials science (metallurgy, ceramics, polymer science, composites

Medical Devices
Veryst works with clients to develop high-performance, reliable, and manufacturable medical devices. We apply advanced characterization technologies, engineering analysis, and sophisticated simulation software to provide cost-effective solutions to time-critical engineering problems.
MEMS & Sensors Reliability
Veryst assists clients with MEMS and sensors consulting through failure analysis, reliability, lifetime prediction, yield enhancement, micro-contamination analysis, and microfluidics and multiphysics simulations. We provide a synergistic approach of combining analytical characterization, empirical studies, and simulation. Veryst scientists are well versed in packaging reliability as well.
MEMS, Sensors, & Microelectronics Failure Analysis

Veryst offers expertise in a full range of analytical tools and techniques for non-destructive and destructive failure analysis.  Choosing the right analytical method is critical for determining the root cause of a failure.  Some of the non-destructive methods we use begin with high magnification

Polymer Analysis
Veryst provides expert services for product design, manufacturing processes, and failure analysis of polymeric components. Our expertise includes experimental characterization, computer modeling, and failure analysis. Our work is based on advanced characterization and physically-based computer models to solve industrial problems involving polymer systems.
Specialized Expertise

Veryst engineers and scientists offer additional specialized expertise in a wide range of important areas, including the following fields.  In each case, we concentrate on meeting client need through the application of fundamental engineering science.

Event

Invited speaker at workshop on MEMS and Sensors, in the Himalayas
Allyson Hartzell was invited to speak at the International Workshop on Nano/Micro 2D and 3D Fabrication and Manufacturing of Electronic and Biomedical Devices and Applications (IWNEBD-2018), at the India Institute of Technology, Mandi. 

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