News & Events

Failure Predictions--Configurational Force

FE software maker describes benefits of PolyUMod® models

The makers of ADINA software have announced that “in response to customers’ requirements,” ADINA supports the Bergstrom-Boyce and Three-Network viscoelastic material models, saying, “These sophisticated material models allow users to capture complex viscoelastic behaviors of polymeric components.” 
MEMS

Article published on MEMS failure mechanisms

Allyson Hartzell has just published a practical guide to “Avoid these common MEMS failure mechanisms” in an article on the EDN Network’s website.  The article provides specific and concrete advice for identifying and avoiding failure mechanisms, as well as helpful tips for system developers.
COMSOL Blog header

Veryst study presented in COMSOL blog

Dr. Alireza Kermani used CFD software to prepare an evaluation of ventilation system design in hospital patient rooms.  The study was presented at COMSOL Conference 2015 Boston and was later the subject of a COMSOL blog.
Veryst logo

Veryst welcomes a new engineer

Dr. Sean Teller has joined Veryst Engineering, bringing extensive experience in the mechanical behavior of materials at low and high strain rates, including viscoelasticity, viscoplasticity, nonlinear materials, and fracture mechanics.
Microfluidics

Presentation at fluid dynamics meeting

Dr. Matthew Hancock presented "Simulations of Micropumps Based on Tilted Flexible Fibers" at the American Physical Society's 68th Annual Division of Fluid Dynamics (DFD) Meeting,
ASME 2015

Presentation at ASME IMECE

Dr. Stuart Brown coauthored the “Child Resistant Closure Performance Aging Study” and presented this paper at the American Society of Mechanical Engineers International Mechanical Engineering Congress & Exposition.
Fluid Systems

Participation in FluidicMEMS event

FluidicMEMS is an informal gathering of people from academia, medicine, industry, and business to meet and explore how microfluidic and BioMEMS technology will impact healthcare, research, and beyond. 
Underfill Adhesive Flow and Cure Schematic

Presentation at adhesives and microelectronics packaging conferences

Dr. Mark Oliver made presentations on "Testing and Modeling the Mechanical Behavior of Flexible Adhesives" and on "Multiphysics Modeling of Underfill Flow and Cure During Thermocompression Bonding" at two industry conferences.
COMSOL Certified Consultant logo

Gold Sponsor of COMSOL Conference 2015

In addition to being a Gold Sponsor of this event, Veryst engineers presented four papers at the conference, including a plenary talk by Dr. Stuart Brown titled “Forensic Engineering: Multiphysics Simulation Unravels Elevator Brake Failure.”

Can we help? Just want to keep in touch?