Helical springs are used in nearly every industry, from medical devices to cars and planes, from toys and consumer products to industrial products. This COMSOL blog describes how Veryst developed a simulation app using the Application Builder in the COMSOL Multiphysics software.
Ms. Allyson Hartzell, a MEMS expert and industry leader, co-chaired a technical session and was also invited to participate in what was certainly an interesting discussion at ECTC 2020—a free, virtual event this year.
An article on how "FEA simulation drives new research" addresses the value of app development and notes Veryst's expertise in building customized new apps for clients using COMSOL's Application Builder.
One of the primary challenges in designing adhesively bonded structures is predicting when an adhesive or bonded interface will fail. Dr. Mark Oliver shared two case studies using COMSOL Multiphysics to predict the strength and improve the performance of adhesively bonded structures.
MEMS and sensors expert Allyson Hartzell is a member of a select committee assembled to develop the Heterogeneous Integration Roadmap which serves as “a guideline for the global electronics industry of projected technology needs and opportunities for innovation.”