Solvent bonding, although an effective way to join thermoplastics, can pose process challenges that reduce bond strength. Veryst uses FTIR microscopy to characterize the interface structure of solvent bonds, obtaining a “chemical image” of the solvent-bonded interface. The result is a full understanding of the bond and ways to improve its strength and reliability.
The microelectronics packaging industry relies heavily on adhesive bonding to assemble electronic components. Veryst built a COMSOL Multiphysics model of a thermocompression bonding process to help reduce bonding cycle time by simultaneously optimizing material and process variables.
Veryst is excited to announce that we have expanded our materials analysis capabilities by adding a Fourier-transform infrared (FTIR) microscope to our materials analysis lab.