Case Studies

The material properties of a climbing shoe’s outsole rubber directly affect a rock climber’s performance. Veryst performed friction and compression testing of two climbing shoe rubbers to quantify and compare their performance.

Many engineering applications require understanding the behavior of polymers under cryogenic temperature conditions. Veryst developed a test fixture and method to test materials submerged in liquid nitrogen (LN2) at its boiling temperature of -196°C.

Electroosmotic (EO) pumps are driven purely by electric fields and have no moving parts. Cascading EO pumps reduces voltage requirements. Veryst used computational fluid dynamics (CFD) and semi-analytical equivalent circuit theory to analyze the complex behavior of these pumps.

Thermal management is crucially important for battery performance in consumer products, electric vehicles, and grid-level storage systems. In this case study, Veryst used multiphysics simulations to evaluate different thermal management strategies in prismatic and cylindrical battery packs.

Tires experience large, complex deformation during use, and the highly filled rubbers are difficult to model. Veryst designed and calibrated a custom material model to capture the mechanical behavior of the tire to improve the design.

New total joint replacement prostheses often use ultra-high molecular weight polyethylene (UHMWPE) in load bearing components. Design engineers need to understand the stress and strain distributions in order to extend device life.

Veryst developed a diffusion model accounting for the different layers of the human skin in order to predict the drug concentration profile of a transdermal drug delivery process.

Permeation enhancers are used to improve drug delivery through the skin by altering the structure and dynamics of the skin. Veryst developed a finite element model of drug diffusion from an adhesive patch that accounts for the effect of permeation enhancers.

The microelectronics packaging industry relies heavily on adhesive bonding to assemble electronic components. Veryst built a COMSOL Multiphysics model of a thermocompression bonding process to help reduce bonding cycle time by simultaneously optimizing material and process variables.