News & Events

Webinar on simulating the assembly and failure of adhesive joints

For sophisticated applications of adhesives, simulation can be a powerful tool for improving assembly processes. Dr. Mark Oliver presented a one-hour webinar in which he presented two examples of using COMSOL Multiphysics software to simulate adhesive joints.

Veryst engineer judges emerging technologies at iMatSci Innovators Event

Allyson Hartzell was invited to serve as a judge at the 2017 iMatScit Innovators Event, part of the 2017 MRS Fall Meeting and Exhibit. This year, MRS welcomed 19 innovators to demonstrate their new materials-based emerging technologies.

MEMS and Sensors expert interviewed for the Future of Housing Workshop 2017

Allyson Hartzell participated in this workshop focused on exploring opportunities for “radical innovations” for creating safe, healthy, and affordable housing.  Ms. Hartzell provided insight into the use of MEMS and sensors in future housing projects.

Gold Sponsor of COMSOL Conference 2017

Veryst’s Dr. Stuart Brown delivered a keynote presentation titled “Using Multiphysics to Diagnose the Cause of a Toxic Leak” at this years event (watch a video of the presentation). Veryst also presented a workshop “Modeling of Rubbers and Thermoplastics Using the PolyUMod® Library.”

Presentation at Lab-on-a-Chip Conference 2017

Dr. Matthew Hancock spoke about "Modeling and Simulation of Microfluidic Devices," addressing how an array of modeling tools such as scaling arguments, analytical formulas, and finite element simulations may be leveraged to address microfluidic device development issues.

Webinar on mechanical contact modeling with COMSOL Multiphysics

Dr. Nagi Elabbasi led a one-hour webinar in which he showed how to set up and solve a wide range of mechanical contact problems using COMSOL Multiphysics.

Presentation on polymers at the Zurich University of Applied Sciences, Switzerland

Dr. Jorgen Bergstrom was invited to speak at the Conference on Polymer Modeling in Winterthur, Switzerland. His presentation was titled “Predicting Failure and Fatigue of Polymers.”

COMSOL blog features Veryst's work simulating bonding of underfill adhesives

Veryst’s simulation expertise was highlighted in a COMSOL blog that describes how Veryst simulated the flow and cure of a non-conductive film during the thermocompression bonding process.

Veryst presentation at MEMS Testing & Reliability 2017

Allyson Hartzell's presentation—"Brief History, Current Status, and Emerging Trends"—addressed the newest evaluation methods, the pros and cons of long term reliability testing, emerging trends, and system-level reliability and design-in features for MEMS lifetime and data security.

Can we help? Just want to keep in touch?