News & Events

Join Veryst at COMSOL Conference 2025 Boston!

September 1, 2025

Please join us at the COMSOL Conference 2025 Boston where we’ll be presenting invited talks, posters, and a workshop.

As a platinum sponsor, we will have a booth at the conference and a team of Veryst engineers will be there, ready to talk with you about how we can support your product development with multiphysics simulation, failure analysis, material modeling and testing, and materials engineering.  

We hope you'll stop by to say hello!

Microfluidics

Presentation at Lab-on-a-Chip Conference 2017

Dr. Matthew Hancock spoke about "Modeling and Simulation of Microfluidic Devices," addressing how an array of modeling tools such as scaling arguments, analytical formulas, and finite element simulations may be leveraged to address microfluidic device development issues.
Peristaltic pump

Webinar on mechanical contact modeling with COMSOL Multiphysics

Dr. Nagi Elabbasi led a one-hour webinar in which he showed how to set up and solve a wide range of mechanical contact problems using COMSOL Multiphysics.
Schematic Image of Hose

Presentation on polymers at the Zurich University of Applied Sciences, Switzerland

Dr. Jorgen Bergstrom was invited to speak at the Conference on Polymer Modeling in Winterthur, Switzerland. His presentation was titled “Predicting Failure and Fatigue of Polymers.”
COMSOL Blog header

COMSOL blog features Veryst's work simulating bonding of underfill adhesives

Veryst’s simulation expertise was highlighted in a COMSOL blog that describes how Veryst simulated the flow and cure of a non-conductive film during the thermocompression bonding process.
MEMS

Veryst presentation at MEMS Testing & Reliability 2017

Allyson Hartzell's presentation—"Brief History, Current Status, and Emerging Trends"—addressed the newest evaluation methods, the pros and cons of long term reliability testing, emerging trends, and system-level reliability and design-in features for MEMS lifetime and data security.
SES 2017

Presentation at SES 2017

Dr. Jorgen Bergstrom co-authored a paper titled “Mechanical Properties of 3D Printed Polymeric TPMS Cellular Materials.” Three types of TPMS (triply periodic minimal surfaces) are used to generate polymeric cellular materials and this paper investigates computationally and experimentally their mechanical properties. 
Microfluidics

Presentation at Organ-on-a-Chip World Congress & 3D Culture 2017

Dr. Matthew Hancock's presentation, "Modeling and Simulation of Microfluidic Organ-on-a-Chip Devices," addressed how an array of modeling tools such as scaling arguments, analytical formulas, and finite element simulations may be leveraged to address these microfluidic organ-on-a-chip device development issues.
Journal of Biomechanical Engineering

Publication co-authored with U.S. Food and Drug Administration

Dr. Jorgen Bergstrom has co-authored (in collaboration with Maureen Dreher and Srinidhi Nagaraja of the U.S. Food and Drug Administration) an article titled “Development of a Flow Evolution Network Model for the Stress–Strain Behavior of Poly(L-lactide)” for ASME (the American Society of Mechanical Engineers).
COMSOL News Special Edition--Acoustics

Guest editorial in COMSOL News 2017 Acoustics Edition

Dr. Nagi Elabbasi has a guest editorial article in COMSOL News 2017 Acoustics Edition. The article is titled “How Computational Acoustics Benefits from Multiphysics” and discusses some of the developments and challenges in acoustic simulation

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