Tag: Adhesives
Case study
Real-Time Monitoring of Adhesive Curing and Kinetic Model Calibration
Designing an assembly process using a thermoset adhesive can be challenging without an understanding of the adhesive curing kinetics. Veryst engineers use FTIR spectroscopy to analyze curing and optimize processing steps.Underfill Adhesive Flow and Cure
The microelectronics packaging industry relies heavily on adhesive bonding to assemble electronic components. Veryst built a COMSOL Multiphysics model of a thermocompression bonding process to help reduce bonding cycle time by simultaneously optimizing material and process variables.Service
Adhesive Joints & Interfaces
Veryst assists clients with the selection of adhesive materials, development of bonding processes, and mechanical analysis of interfaces. We employ chemical characterization, mechanical testing, and advanced computational methods to design robust adhesively bonded structures and to understand delamination failures.Medical Devices
Veryst works with clients to develop high-performance, reliable, and manufacturable medical devices. We apply advanced characterization technologies, engineering analysis, and sophisticated simulation software to provide cost-effective solutions to time-critical engineering problems.Specialized Expertise
Veryst engineers and scientists offer additional specialized expertise in a wide range of important areas, including the following fields. In each case, we concentrate on meeting client need through the application of fundamental engineering science.
News item
COMSOL blog features Veryst's work simulating bonding of underfill adhesives
Veryst’s simulation expertise was highlighted in a COMSOL blog that describes how Veryst simulated the flow and cure of a non-conductive film during the thermocompression bonding process.Veryst adds FTIR microscope to materials analysis lab
Veryst is excited to announce that we have expanded our materials analysis capabilities by adding a Fourier-transform infrared (FTIR) microscope to our materials analysis lab.