From smartphones and cameras to wireless headphones and battery packs, portable electronics proliferate. Consumers expect excellent resilience to device drops, increasing pressure on manufacturers to test thoroughly and optimize their designs. Veryst utilized its unique expertise in accurately modeling complex materials, conducting high strain rate testing, and simulating impact events to simulate the drop impact of an external battery pack.
Impact modeling of polymers is important given their use in consumer products as both structures and impact protection. Accurate FE models of impact events require high rate testing, advanced modeling, and a thorough understanding of polymer failure.
Biodegradable polymers are becoming increasingly attractive for consumer product applications such as electronic devices and disposable packaging. Modeling these materials during impact is challenging due to the complexity of the physical event and the scarcity of appropriate material models for biodegradable polymers.
Polymers exhibit significant temperature-dependent mechanical response. Veryst tested a PEEK material at multiple temperatures and calibrated the PolyUMod® Three Network (TN) material model for finite element simulation.
Understanding composite materials’ impact response as a function of fiber direction is important for a wide range of uses, from automotive applications for crashworthiness to consumer product uses for drop and impact resistance. Veryst evaluated the high strain rate response of both glass fiber and carbon fiber reinforced PEEK (polyether ether ketone) using the Split Hopkinson Pressure Bar test method.
This case study demonstrates the testing and calibration of a polycarbonate material at a high strain rate of 1000 sec-1. The testing was done with the Split Hopkinson Pressure Bar (SHPB) system and the calibration is performed with the MCalibration® software, originally developed by Veryst Engineering.
Veryst developed a new test method for measuring fracture toughness under impact loading that does not require measurement of load or crack length. We have used this method to help clients in the automotive and electronics industry understand how adhesives fail under impact conditions.
All commercial FE packages provide material models for polymers, but Veryst Engineering’s PolyUMod® material library has advanced material models at the leading edge of polymer mechanics. We demonstrate the accuracy of a PolyUMod material model with native material models from Abaqus, ANSYS, and LS-DYNA.
Veryst offers expertise in simulation and testing of impact events with specialties including transient simulations, high strain-rate material characterization, modeling of failure mechanisms, and data processing and analysis. Veryst has served a wide range of industries in this area, such as consumer electronics, sports equipment, consumer appliances, and petrochemical engineering.
Veryst’s mechanical testing capabilities have been developed over the past decade and are motivated by the need for high quality data to characterize complex polymer behavior. We tailor our test programs based on our deep understanding of polymer and material mechanics and the challenges complex
Dr. Sean Teller's article appears in RubberWorld magazine’s January, 2019 edition. Dr. Teller explains the different test methods available to test elastomers and TPEs, advantages and disadvantages, and more.
Dr. Mark Oliver spoke about “Applications of Digital Image Correlation in Adhesive Testing: Measuring High-Rate Fracture Toughness and Calibrating Cohesive Zone Models” at the 41st Annual Adhesion Society Meeting.
Dr. Sean Teller offered an on-demand presentation titled "Tensile Specimen Preparation Method Impacting Failure Behavior" at ANTEC Classic 2021, which took place online May 10-21, 2021. He discussed his investigation of the effect of the sample creation process on the results from standard tensile tests.
Dr. Sean Teller spoke about “High Strain Rate Testing and Material Modeling of an Anisotropic Glass Fiber Filled Polyetherimide” at the 15th LS-DYNA International Conference and Users Meeting.