Thermal Analysis
Case study
Calrod Thermal Analysis
How fast does a Calrod heat up and how high are the stresses during heating? To answer these questions Veryst Engineering developed a coupled electric-thermal-structural multiphysics model of the Calrod, accounting for conduction, convection, and radiation.CFD Modeling for a Hospital Room Ventilation System
Efficient ventilation can reduce a building’s energy consumption and minimize airborne pathogen transmission in hospital rooms. Veryst used computational fluid dynamics (CFD) to simulate ventilation in a hospital room as well as the dispersion of particles and droplets.Design and Simulation of a Catheter-Based Acoustic Ablation Device
Thermal ablation is a minimally invasive way to treat tumors, and simulating the physics of ablation can help in the design of ablation devices. Veryst designed and simulated a catheter-based acoustic ablation device relying on acoustic pressure waves to heat tissue to induce necrosis.Infant Incubator Thermal Modeling
The main environmental factor affecting a premature neonate is thermo-neutrality, as the baby is incapable of regulating and maintaining his/her body temperature at a constant level. Veryst developed a computational model of heat transfer inside an infant incubator to optimize its design.LED Light Bulb Heat Transfer Simulation
Both the efficiency and life of an LED bulb drop when operated at high temperature. Given the wide range of possible shapes and sizes of heat sinks, Veryst Engineering developed a rapid and effective tool to compare design alternatives and estimate LED temperatures.RF Tissue Ablation Simulation
Radio frequency tissue ablation is a commonly used and minimally invasive tissue treatment procedure. Accurately modeling this kind of coupled multiphysics problem is often challenging. Veryst developed a COMSOL Multiphysics model accounting for heat transfer, electric field, and fluid flow to study the RF tissue ablation problem where an electrode is targeting a tissue close to a blood vessel.Underfill Adhesive Flow and Cure
The microelectronics packaging industry relies heavily on adhesive bonding to assemble electronic components. Veryst built a COMSOL Multiphysics model of a thermocompression bonding process to help reduce bonding cycle time by simultaneously optimizing material and process variables.Wear in Automotive Disk Brakes
When would an automotive disc brake need to be replaced? The continuous frictional sliding between two deformable surfaces leads to wear accumulation and ultimately failure of the weakest component. However, wear modeling is not readily available in most finite element codes. Veryst developed a wear model in COMSOL Multiphysics using differential equations for the wear depth based on a modified version of Archard's law.Service
Adhesive Joints & Interfaces
Veryst assists clients with the selection of adhesive materials, development of bonding processes, and mechanical analysis of interfaces. We employ chemical characterization, mechanical testing, and advanced computational methods to design robust adhesively bonded structures and to understand delamination failures.Chemical Reactors & Bioreactors
Chemical reactors and bioreactors involve many layers of physics, including fluid flow, heat transfer, chemical reactions, and porous media. A deep knowledge of the underlying physical phenomena is essential when scaling up reactors.Computational Fluid Dynamics (CFD)
Veryst possesses advanced computational fluid dynamics (CFD) and computational microfluidics capabilities. We solve hard-to-address problems often involving coupled and nonlinear behaviors, such as those found in fluid/solid or fluid/thermal interactions.Fluids
Veryst offers state-of-the-art consulting in the design and analysis of gaseous and fluid systems and products. We employ advanced CFD analysis to solve problems involving fluid mixing, multiphase flow, phase change, non-Newtonian fluids, and microfluidic effects.Microfluidics
Veryst offers a comprehensive approach to solving problems in microfluidic device development.