Allyson Hartzell co-chaired a Bioelectronics session and gave a talk on "The Importance of MEMS Cavity Gas Composition" at the 31st Annual Electronics Packaging Symposium – Small Systems Integration.
Ms. Allyson Hartzell, a MEMS expert and industry leader, co-chaired a technical session and was also invited to participate in what was certainly an interesting discussion at ECTC 2020—a free, virtual event this year.
Allyson Hartzell co-chaired the “MEMS, Sensor, IoT and Flex” session of ECTC 2018, the annual conference of the IEEE Electronic Components and Technology Conference in San Diego, CA.
Allyson Hartzell co-chaired the Mechanical Reliability session, provided a one-hour tutorial on “Reliability Considerations for Flexible Hybrid Electronics" as part of the Structural and Physical Health Monitoring track, and more.
Allyson Hartzell offered a webinar addressing some of the newer MEMS and sensor devices with advanced packaging and flexible interconnects for wearable technologies, and addressed how to assess and model reliability.