Clean Manufacturing
Veryst consults in clean manufacturing, which is common for precision products that are deleteriously affected by particulate, molecular contamination, and human contamination. Key areas are: target contamination control levels for the room and equipment, detection and measurement of contamination, transport and deposition of contamination, removal of contamination, and sources of contamination.
MEMS & Sensors Reliability
Veryst assists clients with MEMS and sensors consulting through failure analysis, reliability, lifetime prediction, yield enhancement, micro-contamination analysis, and microfluidics and multiphysics simulations. We provide a synergistic approach of combining analytical characterization, empirical studies, and simulation. Veryst scientists are well versed in packaging reliability as well.


MEMS expert speaking at Electronics Packaging Symposium
Allyson Hartzell co-chaired a Bioelectronics session and gave a talk on "The Importance of MEMS Cavity Gas Composition" at the 31st Annual Electronics Packaging Symposium – Small Systems Integration.
Session chair on MEMS & sensors; panelist discussing how workplace diversity drives innovation, productivity
Ms. Allyson Hartzell, a MEMS expert and industry leader, co-chaired a technical session and was also invited to participate in what was certainly an interesting discussion at ECTC 2020—a free, virtual event this year.
Session co-chair at ECTC 2018
Allyson Hartzell co-chaired the “MEMS, Sensor, IoT and Flex” session of ECTC 2018, the annual conference of the IEEE Electronic Components and Technology Conference in San Diego, CA.
Tutorial offering, panelist, and session co-chair at ASME InterPAK 2018
Allyson Hartzell co-chaired the Mechanical Reliability session, provided a one-hour tutorial on “Reliability Considerations for Flexible Hybrid Electronics" as part of the Structural and Physical Health Monitoring track, and more.
Webinar on the reliability of MEMS and Sensors in wearable systems
Allyson Hartzell offered a webinar addressing some of the newer MEMS and sensor devices with advanced packaging and flexible interconnects for wearable technologies, and addressed how to assess and model reliability.

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