A commonly encountered failure mode in microfluidic devices is delamination between adjacent device layers. Veryst examined the influence of control channel geometry on the delamination pressure of a pneumatic microfluidic valve using finite element analysis.
The responses of a MEMS switch immersed in fluids differs from that in a vacuum. Veryst Engineering developed a coupled electrostatic-fluid-structure interaction model to investigate the switch response time, deformation, and energy dissipation.
How long will a product last? This is an essential question during product development, but accurately predicting product end of life can be hampered by limited data. Veryst provides a method for the reliability engineer to predict end of life with a small sample size and shows how the proper lifetime prediction method can eliminate unexpected field failures.
Veryst has strong acoustic simulation expertise in a wide variety of applications, including medical devices and wearable technology. In many cases, acoustic problems cannot be solved adequately using a single-physics approach, and Veryst has extensive experience in solving multiphysics problems involving acoustics.
Veryst consults in clean manufacturing, which is common for precision products that are deleteriously affected by particulate, molecular contamination, and human contamination. Key areas are: target contamination control levels for the room and equipment, detection and measurement of contamination, transport and deposition of contamination, removal of contamination, and sources of contamination.
The consultants at Veryst provide failure and root cause analyses using core engineering disciplines to evaluate different failure scenarios. Engineering specialties we apply to failure analyses include: mechanical engineering, materials science (metallurgy, ceramics, polymer science, composites
Veryst assists clients with MEMS and sensors consulting through failure analysis, reliability, lifetime prediction, yield enhancement, micro-contamination analysis, and microfluidics and multiphysics simulations. We provide a synergistic approach of combining analytical characterization, empirical studies, and simulation. Veryst scientists are well versed in packaging reliability as well.
Veryst offers expertise in a full range of analytical tools and techniques for non-destructive and destructive failure analysis. Choosing the right analytical method is critical for determining the root cause of a failure. Some of the non-destructive methods we use begin with high magnification
Accurate simulation of many products now requires a multiphysics approach. Veryst Engineering specializes in multiphysics problems involving solids, fluids, heat transfer, mass transfer, acoustics, and electromagnetics. Our modeling and analysis expertise includes fluid-structure interaction, thermal-structure interaction, structural-acoustic vibrations, conjugate heat transfer, Joule heating, and microwave heating.
Veryst engineers and scientists offer additional specialized expertise in a wide range of important areas, including the following fields. In each case, we concentrate on meeting client need through the application of fundamental engineering science.
Veryst’s mechanical testing capabilities have been developed over the past decade and are motivated by the need for high quality data to characterize complex polymer behavior. We tailor our test programs based on our deep understanding of polymer and material mechanics and the challenges complex
Allyson Hartzell has just published a practical guide to “Avoid these common MEMS failure mechanisms” in an article on the EDN Network’s website. The article provides specific and concrete advice for identifying and avoiding failure mechanisms, as well as helpful tips for system developers.
Veryst is pleased to announce that Allyson Hartzell, an expert in MEMS, was approved as a member of the Advanced Packaging Committee for ECTC (the Electronic Components and Technology Conference) 2017.
NASA (National Aeronautics and Space Administration) Tech Briefs, a design engineering publication focused on reporting significant new technologies, has published an article by Veryst engineers Allyson Hartzell and Andrew Spann titled “Solving the Interconnect Challenge: How to Bring Flexibility to Wearable Design.”
MEMS and sensors expert Allyson Hartzell is a member of a select committee assembled to develop the Heterogeneous Integration Roadmap which serves as “a guideline for the global electronics industry of projected technology needs and opportunities for innovation.”