Adhesives

Webinar

Adhesive Testing and Material Model Calibration for FEA of Bonded Joints--2023

In this free, one-hour webinar, we will share the basics of how to develop material models for adhesives to be used in commercial finite element analysis (FEA) codes.  We will cover both continuum material modeling and cohesive zone modeling. 

High-Rate Testing of Adhesives and Composites
The high-rate mechanical properties of adhesives and composites are important for numerous industries, including automotive, consumer electronics, and defense. In this webinar, we will demonstrate how to characterize composites and adhesive joints to understand joint performance under impact loading conditions. We will discuss how recent innovations in high-speed imaging can be leveraged to characterize structural adhesives at high strain rates.
Interfacial Stress and Delamination in Layered Structures
This webinar will introduce the mechanics of interfacial stress and delamination in layered structures, with the goal of helping engineers better predict and prevent delamination failures. We will survey the sources and basic characteristics of mechanical stress at interfaces as well as introduce the practical experimental, analytical, and computational approaches available for analyzing delamination failures.

Case study

Accelerated Creep Testing of Polymers with Time-Temperature Superposition
A medical device designer wanted to forecast the creep performance of a plastic part for at least two years. Veryst tested the material using time-temperature superposition to characterize the material’s long-term performance quickly and efficiently to determine if the design performs adequately after two years.
Adhesive Cure Troubleshooting with Differential Scanning Calorimetry (DSC)
An adhesive joint was failing in the field. Veryst used DSC to investigate and determined the root cause to be improper curing of the adhesive.
Adhesively Joining Difficult Materials with Corona Plasma Treatment
Joining polyolefins such as polyethylene and polypropylene with adhesives can be challenging. Polyolefins have low surface energy, which creates weak bonds between the polyolefin material and the adhesive. Veryst used corona discharge plasma treatment to improve the bond strength and create a more robust joint.
Cohesive Zone Model (CZM) Calibration
Cohesive zone modeling is a powerful tool for predicting delamination in adhesively bonded structures. Veryst engineers use their expertise in experimental and computational fracture mechanics to calibrate cohesive zone models for accurate prediction of adhesive failure.
Delamination in Microfluidic Valves
A commonly encountered failure mode in microfluidic devices is delamination between adjacent device layers. Veryst examined the influence of control channel geometry on the delamination pressure of a pneumatic microfluidic valve using finite element analysis.
FTIR Microscopy Analysis of Thermoplastic Solvent Bonding
Solvent bonding, although an effective way to join thermoplastics, can pose process challenges that reduce bond strength. Veryst uses FTIR microscopy to characterize the interface structure of solvent bonds, obtaining a “chemical image” of the solvent-bonded interface. The result is a full understanding of the bond and ways to improve its strength and reliability.
High Rate Foam Testing
Foam materials often exhibit high strain rate sensitivity, with large increases in stiffness as materials are loaded at higher rates. Veryst performed high-rate compression tests of a foam material, reaching impact strain rates of over 1500/s.
Impact Fracture Toughness of Adhesive Joints
Veryst developed a new test method for measuring fracture toughness under impact loading that does not require measurement of load or crack length. We have used this method to help clients in the automotive and electronics industry understand how adhesives fail under impact conditions.
Optimizing Additively Manufactured Parts for Adhesive Assembly
Veryst used topology optimization to design an additively manufactured bracket for adhesive assembly and then used cohesive zone modeling to predict the strength of the bonded joint.
Peeling of a Soft Polymer Film
The peel test is widely used to measure the adhesion of thin, compliant films to rigid substrates. An accurate model of the peeling mechanics is required to extract the interface adhesion energy. Veryst used the PolyUMod® material model library along with a cohesive zone model of interface adhesion to simulate the peeling of a soft viscoplastic film from a rigid substrate.
Real-Time Monitoring of Adhesive Curing and Kinetic Model Calibration
Designing an assembly process using a thermoset adhesive can be challenging without an understanding of the adhesive curing kinetics. Veryst engineers use FTIR spectroscopy to analyze curing and optimize processing steps.
Underfill Adhesive Flow and Cure
The microelectronics packaging industry relies heavily on adhesive bonding to assemble electronic components. Veryst built a COMSOL Multiphysics model of a thermocompression bonding process to help reduce bonding cycle time by simultaneously optimizing material and process variables.

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