In this free, one-hour webinar, we will share the basics of how to develop material models for adhesives to be used in commercial finite element analysis (FEA) codes. We will cover both continuum material modeling and cohesive zone modeling.
A medical device designer wanted to forecast the creep performance of a plastic part for at least two years. Veryst tested the material using time-temperature superposition to characterize the material’s long-term performance quickly and efficiently to determine if the design performs adequately after two years.
An adhesive joint was failing in the field. Veryst used DSC to investigate and determined the root cause to be improper curing of the adhesive.
Joining polyolefins such as polyethylene and polypropylene with adhesives can be challenging. Polyolefins have low surface energy, which creates weak bonds between the polyolefin material and the adhesive. Veryst used corona discharge plasma treatment to improve the bond strength and create a more robust joint.
Cohesive zone modeling is a powerful tool for predicting delamination in adhesively bonded structures. Veryst engineers use their expertise in experimental and computational fracture mechanics to calibrate cohesive zone models for accurate prediction of adhesive failure.
A commonly encountered failure mode in microfluidic devices is delamination between adjacent device layers. Veryst examined the influence of control channel geometry on the delamination pressure of a pneumatic microfluidic valve using finite element analysis.
Solvent bonding, although an effective way to join thermoplastics, can pose process challenges that reduce bond strength. Veryst uses FTIR microscopy to characterize the interface structure of solvent bonds, obtaining a “chemical image” of the solvent-bonded interface. The result is a full understanding of the bond and ways to improve its strength and reliability.
Veryst developed a new test method for measuring fracture toughness under impact loading that does not require measurement of load or crack length. We have used this method to help clients in the automotive and electronics industry understand how adhesives fail under impact conditions.
Veryst used topology optimization to design an additively manufactured bracket for adhesive assembly and then used cohesive zone modeling to predict the strength of the bonded joint.
The peel test is widely used to measure the adhesion of thin, compliant films to rigid substrates. An accurate model of the peeling mechanics is required to extract the interface adhesion energy. Veryst used the PolyUMod® material model library along with a cohesive zone model of interface adhesion to simulate the peeling of a soft viscoplastic film from a rigid substrate.
Designing an assembly process using a thermoset adhesive can be challenging without an understanding of the adhesive curing kinetics. Veryst engineers use FTIR spectroscopy to analyze curing and optimize processing steps.
The microelectronics packaging industry relies heavily on adhesive bonding to assemble electronic components. Veryst built a COMSOL Multiphysics model of a thermocompression bonding process to help reduce bonding cycle time by simultaneously optimizing material and process variables.
Veryst assists clients with the selection of adhesive materials, development of bonding processes, and mechanical analysis of interfaces. We employ chemical characterization, mechanical testing, and advanced computational methods to design robust adhesively bonded structures and to understand delamination failures.
Veryst works with clients to develop high-performance, reliable, and manufacturable medical devices. We apply advanced characterization technologies, engineering analysis, and sophisticated simulation software to provide cost-effective solutions to time-critical engineering problems.
Veryst engineers and scientists offer additional specialized expertise in a wide range of important areas, including the following fields. In each case, we concentrate on meeting client need through the application of fundamental engineering science.